LIQUID COOLED HEAT SINK WITH COLD PLATE RETENTION MECHANISM

摘要

A system for cooling electronic components (2) with a surface (79) having one or more electronic components (81), including an integrated circuit (77), mounted thereon. A liquid cooled heat exchanger (4) located on overlying contacting relation with the integrated circuit (77). A resilient cold plate (6) coupled to the surface (79) so as to be biased by a portion of the liquid cooled heat exchanger (4) thereby providing a forced engagement between the liquid cooled heat exchanger (4), the integrated circuit (77) and the resilient cold plate (6).