| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily polish using an inexpensive and low precise polishing device even if a polishing process is required at the time of manufacturing a semiconductor device called as BGA, for example. <P>SOLUTION: Semiconductor constructions 3 called as CSP are arranged in a plurality of places on a bonding layer 2 on a base plate 1 in a size corresponding to a plurality of semiconductor devices. An insulating material 13A formed of semi-cured thermosetting resin comprising glass fiber is arranged between the semiconductor construction 3. Heating and pressurization are preformed by using a pair of heating pressuring plates. Thus, an insulating material whose upper face becomes almost flush as an upper face of the semiconductor construction 3 is formed. Even if resin in the insulating material 13A flows out onto the semiconductor construction 3, it can easily be polished and removed by using an inexpensive and low precise buff or endless polishing belt. An upper layer insulating film, an upper layer rewiring and solder balls are formed on it. When a part between the adjacent semiconductor constructions 3 is cut, a plurality of semiconductor devices having the solder balls can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT |
