| 摘要 |
PROBLEM TO BE SOLVED: To materialize a miniaturization of an RF module, while maintaining characteristics such as RF characteristics and heat dissipation characteristics. SOLUTION: A module board MCB, wherein an IC chip and a passive component are mounted, has a monolayer wiring structure where a conductive pattern 36S used for signal transmission and a conductive pattern containing a conductive pattern 36G for connecting to the reference electrically are stuck to an insulating board 37. It has also a coplanar line structure where the conductive pattern 36S and the conductive pattern 36G are parallel, and IC chips and passive components are connected with the conductive patterns 36S and 36G in an opening formed in the insulating board 37. COPYRIGHT: (C)2007,JPO&INPIT |
