| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can individually mold a plurality of semiconductor chips mounted on a single face of a substrate. <P>SOLUTION: The semiconductor device manufacturing method consists of steps of arranging a plurality of semiconductor elements 102 on the surface of a substrate 100; fixing the rear face side of the substrate 100 on a lower metal mold 130; supplying a liquid resin 114 to each semiconductor element 102 from a nozzle 112 so that at least part of each semiconductor element 102 is covered by the liquid resin 114; pressing an upper metal mold, formed with a plurality of cavities 144, on one surface against the lower metal mold, and then molding the liquid resin 114 by these cavities 144 at a predetermined temperature; and separating the cavities 144 of the upper metal mold 140 from the substrate to form a plurality of individual mold resins, as a lump on the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
