发明名称 DEVICE FOR MOUNTING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To reduce an operation tact time to improve an operation efficiency when mounting components on a substrate. <P>SOLUTION: A device 30 for mounting components includes substrates 32, 32' located in the substrate transferring direction, and an operation head 36 which is located above the substrates 32, 32' and is movable along an X axis 40 and Y axis 41. Moreover, the device 30 includes supplying stages 33, 33' located on the side of substrates 32, 32', a component recognition camera 38 which is fixed on the X axis 40 and can recognize the component held on the operation head 36 while it is moving along the X axis 40, and a control unit 42 which controls the movement of the operation head 36. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005672(A) 申请公布日期 2007.01.11
申请号 JP20050186048 申请日期 2005.06.27
申请人 YAMAGATA CASIO CO LTD 发明人 KUSAKABE KENJI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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