| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a closure processor with a matching structure for a high frequency induction heating apparatus saving on a space reducing cost without using any expensive high current resistant type water cooled cable, and reducing current loss. <P>SOLUTION: The matching part 26 for the high frequency induction heating apparatus 40 is composed from a single flat plate 20, a transformer 12, and a capacitor 11 for resonance placed on the flat plate 20. While the transformer 12 and the capacitor 11 for resonance of the matching part 26 are installed in the vicinity of a processing subject (for example, a hollow pipe 14), and a high frequency induction heating coil 13 is connected to the transformer 12, the capacitor for resonance is connected to a main body of the high frequency induction heating apparatus provided with an invertor 4 in a position separated from the matching part 26. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
