| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with high air-tightness and a manufacturing method thereof. SOLUTION: The electric component 10A includes: a base board 11A formed thereon with a prescribed circuit pattern; a mount board 12A arranged oppositely to the base board 11A; a joining layer 17 for joining the base board 11A with the mount board 12A; and a sealing member 20 for sealing the base board 11A and including opening ends 21, 21, and the opening ends 21, 21 are configured to be provided in the board thickness of the mount board 12A. Leakage between interior and exterior of the electric component 10A can effectively be prevented and the air-tightness of the electric component 10A can be enhanced. COPYRIGHT: (C)2007,JPO&INPIT
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