| 摘要 |
An image capturing element package for an electronic endoscope is provided with a solid-state image capturing element, an insulating base member made of electronically insulating material and configured to hold the image capturing element, a metallic package housing surrounding the solid-state image capturing element, a proximal end portion of the metallic package housing being air-tightly welded to the insulating base member, a window portion being formed on a front end surface of the metallic package housing, a cover glass air-tightly secured to the window portion, and a housing reinforcing member arranged along an inner surface of the metallic package housing, the housing reinforcing member being formed not to deform when a force exceeding strength at which the package housing is durable against deformation.
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