发明名称 Method of forming openings in an organic resin material
摘要 A thin film of organic resin material ( 17 ), such as novolac, is used as an etch mask and openings ( 32 ) are formed in the mask in a predetermined pattern to allow processing in selected areas defined by the openings. The openings ( 32 ) are formed by applying a pattern of droplets ( 76 ) of caustic etchant, such as sodium hydroxide (NaOH) or potassium hydroxide (KOH) in the areas where the openings are to be formed. The droplets ( 76 ) are applied using a inkjet printer ( 90 ) which is scanned over the surface of the organic resin as the droplets are applied. The droplets ( 76 ) are of a size which defines the dimension of the openings ( 32 ) and allows the organic resin ( 17 ) under the droplet ( 76 ) to be completely removed. After the etchant has etched through the organic resin to expose an underlying surface ( 12 ), the etchant is washed from the organic resin and the openings ( 32 ).
申请公布号 US2007007627(A1) 申请公布日期 2007.01.11
申请号 US20060569652 申请日期 2006.02.24
申请人 CSG SOLAR AG 发明人 YOUNG TREVOR L.;LASSWELL PATRICK
分类号 H01L29/06;B41J2/01;H01L21/027;H01L21/311;H01L27/142 主分类号 H01L29/06
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