| 摘要 |
The invention relates to a multilayer printed circuit board structure comprising a stack of a plurality of electrically insulating and/or electroconductive layers (7, 9, 10, 11) and at least one passive or active electrical component (2) arranged inside the stack of layers, said component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component (2) mounted on said stack, to an associated wiring (4, 5), and to a corresponding production method. According to the invention, the insert (1) is embedded between two electrically insulating liquid resin layers or prepreg layers (7, 9) extending over the entire surface and covering the insert on both sides, said insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The inventive structure can be used in printed circuit board technology. |
