发明名称 |
Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung |
摘要 |
<p>A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7. <IMAGE></p> |
申请公布号 |
DE60032067(D1) |
申请公布日期 |
2007.01.11 |
申请号 |
DE2000632067 |
申请日期 |
2000.07.13 |
申请人 |
NITTO DENKO CORP. |
发明人 |
NAKAMURA, KEI;SUGIMOTO, MASAKAZU;INOUE, YASUSHI;OKEYUI, TAKUJI;NAGASAWA, MEGUMU |
分类号 |
H05K3/46;H05K3/40;H05K3/44 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|