| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform the reduction of solder without using hydrogen radical atmosphere and to drive out a void in molten solder. <P>SOLUTION: In a reducing atmosphere or an inert atmosphere which is approximately atmospheric pressure, by heating the solder 6, a substrate 2 to be soldered with the solder and an IC4, the solder is molten. In this molten state, the pressure is evacuated from the approximately atmospheric pressure. Next, the atmosphere is returned to the reducing atmosphere or the inert atmosphere of approximately atmospheric pressure. After this pressure change, the substrate, the IC and the solder are cooled in the reducing atmosphere or the inert atmosphere of approximately atmospheric pressure. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
