| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent breakdown of a semiconductor element by suppressing cracking in an interface between the semiconductor element and a metal plate. <P>SOLUTION: A metal plate 10 comprises a first metal 11 (pure aluminum) as the body, and a second metal 12 (pure copper) embedded therein. The mounting surface of the plate has a first region R1 made of the first metal and a second region R2 made of the second metal. A semiconductor element 20 is mounted on the metal plate with its corners K, in direct contact with the second region R2. Since the second metal is larger in breakdown deformation than that of the first metal, the second metal absorbs distortions due to thermal stresses. Since cracks in the corners or in the vicinities thereof, susceptible to a concentrated thermal stress or destruction of the semiconductor element, can be prevented, reliability is increased. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
