发明名称 ADHESIVE SHEET FOR DICING
摘要 PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of completely preventing raptures at expansion process, a process method for a structure to be cut using the former, and a small piece of the structure to be cut obtained by the method. SOLUTION: The adhesive sheet 11 for dicing for use in processing of the structure to be cut includes an adhesive layer 2, provided on at least one surface of a base member 1. Modulus of elongation of the base member 1 is 50 to 250 MPa, with rupture elongation of≥200%, and the degree of cut resistance represented by the formula: degree of cut resistance=(rupture strength of the base member)/(tensile strength at 30% tensile elongation of the base member) is≥2.5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005436(A) 申请公布日期 2007.01.11
申请号 JP20050181744 申请日期 2005.06.22
申请人 NITTO DENKO CORP 发明人 YAMAMOTO MASASHI;HASHIMOTO KOICHI;SHINTANI TOSHIAKI
分类号 H01L21/301;C09J7/02;C09J201/00 主分类号 H01L21/301
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