| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, achieving excellent flame retardancy without damaging fluidity characteristics, and also having excellent reliability in moist condition or the like; and to provide an electronic part device having an element sealed by using the composition. SOLUTION: The epoxy resin composition for the sealing comprises (A) an epoxy resin, (B) a phenolic curing agent and (C) a hydrotalcite compound represented by general formula (1) (wherein, 0<X≤0.5; m is 0 or a positive number; and A is an n-valent anion) and previously treated with an alkoxysilane having a functional group reactive with at least one of the epoxy group of the epoxy resin (A) and the phenolic hydroxy group of the phenolic curing agent (B). COPYRIGHT: (C)2007,JPO&INPIT
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