发明名称 MANIFOLD FOR INJECTING CLEAN SOLUTION AT THE WAFER CLEANING APPARATUS
摘要 A manifold for injecting a cleaning solution in a wafer cleaning apparatus is provided to prevent a holder from being cracked by the load of a drip bar by uniformly dispersing the load of the drip bar to a shaft fixed to an outer frame and by including a plurality of holders formed between a plurality of nozzles for injecting a cleaning solution to an upper brush. A shaft(573) runs in parallel with a wafer. One side of the shaft is inserted into a hanger(574) including a pipe for flowing a cleaning solution in a direction vertical to the shaft. An elbow pipe(575) is coupled to the pipe of the hanger. A drip bar(577) is made of a straight line shape parallel with the wafer, having a plurality of nozzles(576) for injecting the cleaning solution. A holder(578) controls the injection direction of the cleaning solution injected through the drip bar and the nozzle. The drip bar and the shaft are inserted into the holder between the plurality of nozzles so that the drip bar is fixed to the shaft to disperse the load of the drip bar. The drip bar and the shaft are formed in a manner that one side or both sides of the drip bar have a flat surface such that the drip bar is made of a cylindrical shape so as to be prevented from being rotated in the holder.
申请公布号 KR20070005944(A) 申请公布日期 2007.01.11
申请号 KR20050059999 申请日期 2005.07.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KYO MIN
分类号 H01L21/304 主分类号 H01L21/304
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