发明名称 TEMPERATURE MEASURING DEVICE, THERMAL TREATMENT DEVICE USING THE SAME, TEMPERATURE MEASURING METHOD
摘要 <p>There are provided a temperature measuring device, method, and a thermal treatment device which are appropriately used for measuring a temperature of a substrate subjected to thermal treatment performing rapid heating. The temperature measuring device includes: a light intensity measuring unit for applying a laser beam to an object to be heated having a uniquely defined correlation between a temperature and a refractivity and measuring light intensity characteristic X indicating the relationship between a reflected light or a transmitting light obtained by interference of laser beams multiply reflected in the object to be heated and the time; a calculation unit for acquiring a reproduced object to be heated for obtaining a virtual object to be heated having light intensity characteristic Z nearest to the light intensity characteristic X obtained from the virtual object to be heated when applying a thermal load equivalent to the condition of heading the object to be heated and applying a laser beam having characteristic equivalent to the aforementioned leaser beam to the virtual object to be heated; and a temperature output unit for obtaining a temperature of a predetermined portion of the object to be heated at a predetermined time according to the reproduced object to be heated.</p>
申请公布号 WO2007004644(A1) 申请公布日期 2007.01.11
申请号 WO2006JP313304 申请日期 2006.07.04
申请人 HIROSHIMA UNIVERSITY;HIGASHI, SEIICHIRO 发明人 HIGASHI, SEIICHIRO
分类号 G01K11/12;G01K13/00;G06F17/30 主分类号 G01K11/12
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