| 摘要 |
<p>A mounting substrate and a microphone mounted on the same are provided to reduce an amount of solder by applying a solder part only on the substrate in which a resist film is not formed. A microphone having a circuit board(10) disposed in a capsule(1), a center terminal and a peripheral terminal(21) is mounted on a mounting substrate. The mounting substrate includes a center pattern formed to correspond to the center terminal, peripheral patterns enclosing the center pattern corresponding to the peripheral terminal of the microphone, a connection pattern connecting the peripheral pattern, solder parts formed on the center pattern and the peripheral pattern, and a resist film formed on the mounting substrate.</p> |
