| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processed gas supply structure in which damage by plasma is suppressed, and to provide a processing apparatus using the processed gas structure in a processed gas supply structure for supplying plasma-activated processed gas to a plasma processing room. <P>SOLUTION: A plasma processing apparatus has a processing container holding a processed substrate in an internal space, a processes gas supply structure for supplying processed gas to the processing container, and a plasma-activation means for plasma-activating the processed gas. The processed gas supplying structure has a plurality of tubular portions having a path of the processed gas installed in the internal space, a gas hole which supplies the processed gas from the path to the internal space formed in the tubular portion, and the tubular portion is formed from a ceramic material. <P>COPYRIGHT: (C)2007,JPO&INPIT |
