| 发明名称 |
POLISHING METHOD AND DEVICE THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method and device thereof which has little decline in polishing rate. <P>SOLUTION: The polishing device comprises a rotary platen 11 whose surface is pasted with a polishing pad 13, and a wafer holding mechanism 14 which rotatably holds a wafer 10 while pressing it against the polishing pad 13. The polishing device includes an alcohol supplying means 24 which supplies alcohol to the surface of the polishing pad and an ultrasonic washing means 25 which ultrasonic-washes the surface of the polishing pad supplied with the alcohol. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007005466(A) |
申请公布日期 |
2007.01.11 |
| 申请号 |
JP20050182121 |
申请日期 |
2005.06.22 |
| 申请人 |
TOKYO SEIMITSU CO LTD;NITTA HAAS INC |
发明人 |
FUJITA TAKASHI;ISHIKURA MINAKO;KAWAI NAOKO;MORIOKA YOSHITAKA |
| 分类号 |
H01L21/304;B24B37/00;B24B53/007;B24B53/017 |
主分类号 |
H01L21/304 |
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