| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic component from being subjected to a current-applying impossibility, as the case may be, being detached from a printed board, due to the different thermal-expansion coefficient generated between it and the printed board, etc., when soldering it in a mounting way to the printed board, etc., in such a surface-mounted electronic component having formed soldering terminal electrodes 4 in both its right and left side-surfaces as a chip resistor 1, etc. SOLUTION: In each of both the right and left side-surfaces of the electronic component, each recess 6 is so provided and each terminal electrode 4 is so formed extendedly to each inner surface 6a of each recess 6 that each solder fillet builds up to each recessed electrode-portion. COPYRIGHT: (C)2007,JPO&INPIT
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