| 摘要 |
PROBLEM TO BE SOLVED: To provide an interconnection structure and its manufacturing method capable of solving the problem of a signal delay, preventing a scratch or an exfoliation of a film of a first insulating film at the time of manufacturing, and manufacturing at low cost without increasing a manufacturing steps. SOLUTION: The method for manufacturing the interconnection structure comprises the steps of forming the first insulating film 101 at the predetermined region on a substrate 100; depositing a second insulating film 103 on the other region of the substrate and on the first insulating film, and planarizing so that the film thickness of the second insulating film on the first insulating film becomes 10 to 200 nm; respectively forming an interconnection groove 105 in a laminated region of the first insulating film and the second insulating film, and in a single layer region of the second insulating film; forming a diffusion preventing film on an inside surface of the interconnection groove; and depositing a metal film with its film thickness in which the interconnection groove of the second insulating film is completely filled up and forming an interconnection 106 in the interconnection groove by removing the metal film on the second insulating film. COPYRIGHT: (C)2007,JPO&INPIT
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