| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for preventing exfoliation and scratch on films on a substrate, and also to restrain, as another object, check errors on the substrate on the stage of an exposure apparatus. SOLUTION: The method comprises a plating process (S120) of forming a Cu film 260 on the surface of the substrate 200, a rear-surface polishing process (S122) of polishing the rear surface of the substrate 200, and a surface polishing process (S124) for polishing the Cu film 260 formed on the surface of the substrate 200. COPYRIGHT: (C)2007,JPO&INPIT
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