| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor system that achieves data transfer rate equivalent to those of one-chip LSIs with a low cost. <P>SOLUTION: The semiconductor system includes a package and a plurality of semiconductor chips housed within the package. The plurality of semiconductor chips include external connection pads for connection to the exterior of the package, inter-chip connection pads for connection between the plurality of semiconductor chips, a first ESD protective circuit installed at each external connection pad for prevention of destruction by electrostatic discharge and having a first current driving capability, and a second ESD protective circuit installed at each inter-chip connection pad for prevention of destruction by electrostatic discharge and having a second current driving capability. The second current driving capability is smaller than the first current driving capability. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
