发明名称 METHOD OF MANUFACTURING ELECTRONIC APPARATUS BY MICROEMBOSSING WORK
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic apparatus by a microembossing work. <P>SOLUTION: A forming method of an electronic apparatus on a substrate 10 comprises the steps of applying a microembossing work to the substrate 10, applying a surface treatment to the substrate so that a non-depressed part 11 has a quality of repelling a solution of a first material 60, and depositing the solution of a first material 60 on a depression 12 on the substrate 10 formed by the microembossing work. Thereafter, the substrate is anneal-treated so that a first material is made to be a single face with the surface of the substrate. Thereafter, the first material 60 in the depression can be used as a source or a drain in the following step of forming a TFT, for example. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007005799(A) 申请公布日期 2007.01.11
申请号 JP20060169739 申请日期 2006.06.20
申请人 SEIKO EPSON CORP 发明人 LI SHUNPU;NEWSOME CHRISTOPHER;RUSSEL DAVID;KUGLER THOMAS
分类号 H01L21/28;H01L21/288;H01L21/3205;H01L21/336;H01L29/786;H01L51/00;H01L51/05;H01L51/10 主分类号 H01L21/28
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