| 摘要 |
PROBLEM TO BE SOLVED: To join a first substrate and a second substrate with a high positional accuracy while simplifying the structure of the interior of a chamber. SOLUTION: The substrate joining equipment 1 includes a substrate placement mechanism 2 for placing the first substrate 91 on the second substrate 92 in the atmosphere, and a joining mechanism 3 for joining the first substrate 91 to the second substrate 92 in the depressurized environment or in the inactive gas environment. In the substrate joining equipment 1, the alignment between the first and second substrates 91 and 92 is done in the atmosphere, with the bottom face 911 of the first substrate 91 laid on top of the top face 921 of the second substrate 92, and then the first and the second substrates 91 and 92 are carried into the chamber 31 of the joining mechanism 3 in a state that the first substrate 91 is placed on top of the second substrate 92. Due to this structure, there is no necessity of installing the alignment-related mechanism inside the chamber 31, which simplifies the structure of the interior of the chamber 31. Moreover, since the alignment-related mechanism does not suffer from deformation due to the influence by the depressurized atmosphere, the first and second substrates 91 and 92 can be joined together at a high positional accuracy. COPYRIGHT: (C)2007,JPO&INPIT |
