| 摘要 |
Vias are formed on each of a plurality of layers of transducer material prior to stacking. Using a desired electrode pattern or removal of strips, pairs of electrodes associated with each layer of transducer material are provided in a coplanar structure on each side of the layer. The smaller of the electrode structures on a given side is routed through the vias to a larger electrode structure. When the layers are stacked, the vias are used for interconnecting the electrodes between various layers. The electrical connection is provided through asperity contact.
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