发明名称 |
Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof |
摘要 |
A board assembly apparatus and a manufacturing method includes applying solder paste onto a first surface of a first board, arranging electronic components on the first surface of the first board on which the solder paste is applied, arranging a second board above the electronic components and the first surface of the first board, and curing the solder paste.
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申请公布号 |
US2007007322(A1) |
申请公布日期 |
2007.01.11 |
申请号 |
US20060325308 |
申请日期 |
2006.01.05 |
申请人 |
LEE JONG-SUNG;KIM YOON-SUNG;MOON YOUNG-JUN;JANG SE-YOUNG |
发明人 |
LEE JONG-SUNG;KIM YOON-SUNG;MOON YOUNG-JUN;JANG SE-YOUNG |
分类号 |
B23K31/02;B23K31/00 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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