发明名称 |
REDUCTION OF ATTRACTION FORCES BETWEEN SILICON WAFERS |
摘要 |
The present invention is related to a method for reducing attraction forces between wafers (4). This method is characterized in that it comprises the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). The invention comprises also a wafer singulation method and an agent for use in said methods . |
申请公布号 |
WO2007004890(A1) |
申请公布日期 |
2007.01.11 |
申请号 |
WO2006NO00244 |
申请日期 |
2006.06.26 |
申请人 |
REC SCANWAFER AS;SAUAR, ERIK;WANG, PER ARNE |
发明人 |
SAUAR, ERIK;WANG, PER ARNE |
分类号 |
B28D5/00;B23D57/00;H01L21/00 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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