| 摘要 |
<p>An apparatus for reversing a semiconductor package is provided to shorten an interval of a reversing process by controlling an individually-cut semiconductor package in a manner that the semiconductor package is reversed while the semiconductor package is placed on a frame to be transferred. A placement part(210) in which a plurality of placement grooves(212) for picking up a semiconductor package is formed in a rotation plate(200). The rotation plate is coupled to a frame(100) to be capable of being rotated, reversing the semiconductor package placed in the placement grooves. A package transfer apparatus receives and transfers the semiconductor package reversed by the rotation of the rotation plate, including a first loading part and a second loading part. A first loading groove into which a semiconductor package is loaded and a first non-loading region into which a semiconductor package is not loaded are alternately disposed in the first loading part. A second loading groove into which a semiconductor package is loaded and a second non-loading region into which a semiconductor package is not loaded are alternately disposed in the second loading part. The rotation plate and the package transfer apparatus are installed to transfer relatively. A semiconductor package that is picked up to a placement groove corresponding to the first loading groove and is reversed is loaded into the first loading groove. A semiconductor package which is picked up to a placement groove corresponding to the second loading groove and is reversed is loaded into the second loading groove.</p> |
