| 摘要 |
A thin IC tag (20) formed by folding an electronic component holding film (30) at a folding position (38) to finish the film in a layered and united form. The electronic component holding film (30) has an electronic component module (32) and spiral conductor patterns (34a, 34 b). Of the end sections of the spiral conductor patterns (34a, 34b), end sections on the sides that are not in contact with a predetermined connection section (37) have terminal pads (35, 36), and the terminal pads (35, 36) are electrically connected to each other through the electronic component module (32). The thin IC tag does not cause increase in production processes and production costs and facilitates mounting of electronic components etc. on it. ® KIPO & WIPO 2007
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