| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of accurately forming a solder bump at a low cost by the use of solder balls or solder paste. SOLUTION: A heat-resistant mask 4 is pasted on the solder resist 3 application surface of a work 1 with a heat-resistant adhesive agent 5, thereafter holes 7 are provided in solder bump 9 forming parts, respectively, by irradiation with a laser beam, and a solder ball or a solder paste is put in the holes 7 respectively and melted by heating. When solder balls 9 are each bonded to electrodes 2, the heat-resistant mask 4 is separated off. |
