| 摘要 |
An adhering apparatus (10) is provided with an adhering table (11) for supporting a semiconductor wafer (W), and an adhering unit (12) for adhering an adhesive sheet (S), which has heat- sensitive adhesiveness, on the semiconductor wafer (W). The adhering unit (12) includes a peeling part, which peels a peeling sheet (PS) from the adhesive sheet (S) at the time of unrolling a whole cloth (L) wherein the adhesive sheet (S) is laminated on one surface of the peeling sheet (PS), and a preliminary sheet peeling apparatus (40) provided in the upstream of the peeling part in the whole cloth unrolling direction. The preliminary sheet peeling apparatus (40) is provided with a moving member (50) which reciprocates by being sandwiched between the peeling sheet (PS) and the adhesive sheet (S). The peeling sheet (PS) preliminarily peeled and the adhesive sheet (S) can be temporarily adhered again by a temporarily re-adhering apparatus (41), and the adhesive sheet (S) can be adhered on the wafer (W). ® KIPO & WIPO 2007 |
