BALL GRID ARRAY PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

A BGA(Ball Grid Array) package and its manufacturing method are provided to reduce stress of a semiconductor substrate and an SMD(Surface Mount Device) element by reducing the number of reflow processes for attaching the SMD element and a solder ball. A semiconductor chip(120) is mounted on a side of a substrate(110). Plural solder ball pads(140) are formed on the other side of the substrate. An SMD part(160) is placed on the substrate where a solder paste(165) is applied. A solder ball(150) is placed on a placing zig(200) and contacted to the solder ball pads. The solder paste and the solder ball are melted through a reflow process. The placing zig includes a base(210), a placing hole, and a adhesive tape(220). A surface of the base is faced to the substrate. The placing hole where the solder ball is placed is formed on the base. The adhesive tape is arranged on a lower surface of the placing hole to adhere the solder ball.