发明名称 ELECTROLESS PLATING METHOD AND PLATING FILM OBTAINED BY THE ELECTROLESS PLATING METHOD
摘要 An electroless plating method which can be applied to a treatment object made of precious metal, stainless steel or molybdenum steel, and can improve adhesive force of the plating layer to the plating object by suppressing generation of pin holes between a plating layer and a plating object, and a plating object treated by the electroless plating method are provided. An electroless plating method comprises the steps of: electro-polishing a surface of a plating object(20); subjecting the electro-polished plating object to electric strike plating to form a first plating layer(21) functioning as a protection layer; subjecting the plating object comprising the first plating layer to first electroless plating in a first electroless plating solution comprising metal salts to form a second plating layer(23) on the first plating layer; and subjecting the plating object comprising the first plating layer and the second plating layer to second electroless plating in a second electroless plating solution to form a third plating layer(25) containing fluorine resin.
申请公布号 KR20070005332(A) 申请公布日期 2007.01.10
申请号 KR20050060613 申请日期 2005.07.06
申请人 BUKWANG TECHNOLOGY CO., LTD. 发明人 CHOI, YONG TAE
分类号 C23C18/54 主分类号 C23C18/54
代理机构 代理人
主权项
地址