FLIP-CHIP PACKAGE FOR IMAGE SENSOR AND COMPACT CAMERA MODULE COMPRISING THE SAME

摘要

A flip-chip package for an image sensor is provided to prevent a pixel region of an image sensor chip from being contaminated by liquid adhesive in a flip-chip bonding process of the image sensor chip and an FPCB(flexible printed circuit board) by including a dummy pattern in the outer part of a window of the FPCB. An image sensor pixel region(12) receives light and photoelectrically transforms the received light, formed in an image sensor chip(11). A plurality of bumps(13) for flip-chip bonding is formed on the upper surface of the periphery of the pixel region. The image sensor chip is mounted on a ductile substrate(15), and a window for exposing the image sensor pixel region is formed in the ductile substrate. A circuit pattern(16) is formed on at least the lower surface of the ductile substrate, functioning as an electrical path. Liquid adhesive(18) is deposited between the image sensor chip and the ductile substrate to bond the image sensor chip to the ductile substrate by a flip-chip bonding process. A dummy pattern(14) is interposed between the substrate and the image sensor chip to prevent the adhesive from invading a pixel region of the image sensor chip, positioned between the window of the substrate and the bump of the image sensor chip. The dummy pattern can be formed on one surface of the ductile substrate or on the image sensor chip.