发明名称 SUPERPLASTIC FORMING AND DIFFUSION BONDING PROCESS
摘要 A process is described of forming a structure by diffusion bonding and superplastic forming at least one skin sheet ( 16,18 ) and at least one core sheet ( 10,12 ), the process comprising: a) forming a pack from the at least one skin sheet ( 16,18 ) and the at least one core sheet ( 10,12 ); b) placing the pack in a mould ( 20 ) and heating the pack to a temperature at which the sheets are capable of superplastic deformation; c) injecting a gas between the skin sheet ( 16,18 ) and the core sheet ( 10,12 ) to urge the skin sheet against an internal face of the mould ( 20 ) thereby forming a cavity ( 30 ) between the skin sheet ( 16,18 ) and the core sheet ( 10,12 ); d) injecting gas on the side of the core sheet ( 10,12 ) remote from the skin sheet ( 16,18 ) to urge the core sheet ( 10,12 ) against the skin sheet ( 16,18 ), e) maintaining gas pressure on the said side of the core sheet ( 10,12 ), thereby forming a diffusion bond between the skin sheet ( 16,18 ) and the core sheet ( 10,12 ); and f) maintaining a regulated pressure of helium in the cavity ( 30 ) between the skin sheet ( 16,18 ) and the core sheet ( 10,12 ) during at least part of step d). The use of helium in the cavity allows such gas trapped in a pocket gas between the skin sheet ( 16,18 ) and the core sheet ( 10,12 ) to diffuse through the core sheet to eliminate such pockets, which obstruct the formation of diffusion bonds in step e).
申请公布号 EP1455965(B1) 申请公布日期 2007.01.10
申请号 EP20020788236 申请日期 2002.12.20
申请人 BAE SYSTEMS PLC 发明人 PRICE, HOWARD JAMES
分类号 B21D26/055 主分类号 B21D26/055
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