发明名称 Thermally-stabilized thermal barrier coating and process therefor
摘要 <p>A thermal barrier coating (TBC) (26) and method for forming the coating (26) on a component (10) intended for use in a hostile environment are disclosed. The coating (26) and method are particularly directed to inhibiting sintering, grain coarsening/growth and pore redistribution in the coating (26) during high temperature excursions by providing limited amounts of extremely fine carbide-based and/or nitride-based precipitates (34) preferably formed at defects and pores (32) at and between the grain boundaries of the TBC microstructure. The precipitates (34) pin the TBC grain boundaries and pores (32) during high temperature excursions, with the effect that the TBC microstructure is thermally stabilized. A coating (26) containing the carbides and/or nitrides can be formed using a physical vapor deposition technique in an atmosphere that contains carbon and/or nitride gases or compounds thereof, or by evaporating a source material that contains carbon, carbon-containing compounds, carbides and/or nitrides. &lt;IMAGE&gt;</p>
申请公布号 EP1209321(B1) 申请公布日期 2007.01.10
申请号 EP20010309708 申请日期 2001.11.16
申请人 GENERAL ELECTRIC COMPANY 发明人 RIGNEY, JOSEPH DAVID;DAROLIA, RAMGOPAL
分类号 F01D5/28;C23C4/00;C23C8/02;C23C14/00;C23C14/06;C23C28/00 主分类号 F01D5/28
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