发明名称 |
A monolithic fluid cooled power module and a method of forming the power module |
摘要 |
<p>A monolithic fluid cooled power module comprising a cooling plate with at least one substrate mounted thereon and a cooling module adapted to distribute a flow of fluid over a surface to be cooled. The cooling plate and the cooling module have been assembled in an at least substantially fluid tight manner, and in an at least substantially irreversible manner, and in such a way that the cooling module can distribute a flow of fluid over a surface of the cooling plate. Thereby the cooling plate and the cooling module form a monolithic unit. Since the cooling plate and the cooling module have been assembled in an at least substantially fluid tight and irreversible manner, the risk of leaking cooling fluid is considerably reduced as compared to prior art systems, even if the cooling fluid is under pressure. The cooling plate and the cooling module are preferably assembled using friction stir welding.</p> |
申请公布号 |
EP1742264(A2) |
申请公布日期 |
2007.01.10 |
申请号 |
EP20060012949 |
申请日期 |
2006.06.23 |
申请人 |
DANFOSS SILICON POWER GMBH |
发明人 |
EISELE, RONALD;OLESEN, KLAUS KRISTEN |
分类号 |
H01L23/473 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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