| 摘要 |
A semiconductor device is provided to prevent the convergence of current at a bonding portion of a bump and to keep uniform current density at the bonding portion of the bump by using a plurality of pillar type conductors. A semiconductor device includes a metal line layer and an outer connection electrode terminal. The metal line layer(41) is formed on a semiconductor substrate(31). The metal line layer is prolonged along a predetermined direction. The outer connection electrode terminal is arranged on the metal line layer through a plurality of pillar type conductors(43). The plurality of pillar type conductors are arranged within a predetermined region, wherein the predetermined region is defined by a connection opening portion. |
