Method of manufacturing an electronic device

摘要

The electronic device ( 100 ) comprises an electrical element ( 30 ), for instance a MEMS capacitor or a BAW filter in a cavity ( 37 ) that is protected from the environment by a cover ( 38 ). The cover ( 38 ) is a patterned layer which is mechanically embedded in isolating material ( 7 ) present beside the cavity ( 37 ) and may further include contact pads ( 41 ). The device ( 100 ) may be suitably manufactured from an accurately folded foil including a patterned layer and a sacrifice layer. After applying the foil to the cavity ( 37 ) the isolating material ( 7 ) is provided and the sacrifice layer is removed. The patterned layer, or part thereof, stays behind and forms the cover ( 38 ).