CHIP ATTACHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING CENTER PAD TYPE SEMICONDUCTOR CHIP

摘要

A chip attaching apparatus for manufacturing a semiconductor package with a center pad type semiconductor chip is provided to prevent the contamination of a lower surface of a bonder head and to restrain the generation of an adhesive protrusion due to the contamination of the bonder head using a concave portion of the bonder head corresponding to a through hole. A chip attaching apparatus for manufacturing a semiconductor package with a center pad type semiconductor chip includes an index rail, a bonder stage, and a bonder head. The index rail is used for transferring a PCB(Printed Circuit Board)(110) with a through hole(112), a metal line(114) and an adhesive layer. The bonder stage(150) is installed under the index rail in order to transfer a center pad type semiconductor chip(140) to a lower surface of the PCB. The bonder head(160) is installed on the index rail corresponding to the bonder stage in order to attach the semiconductor chip to the PCB, wherein center pads of the semiconductor chip are exposed to the outside through the through hole of the PCB. The bonder head includes a concave portion(162) corresponding to the through hole of the PCB.