| 摘要 |
A method for manufacturing a radiant heat circuit board is provided to improve the radiant heat efficiency of the radiant heat circuit board by transmitting and radiating heat generated from a circuit pattern or electronic products to a lower metal directly without blocking the heat by an insulation layer. A method for manufacturing a radiant heat circuit board includes the steps of: forming a substrate by stacking a lower metal and an upper metal on an insulation layer(S310); forming at least one penetration hole which penetrates the insulation layer, the upper metal, and the lower metal on the substrate which is stacked in the step of stacking(S320); and inserting and fixing a metallic pin for a heat transmission into the penetration hole which is formed in the step of forming the hole(S330). In the stacking step, the upper/lower metals are stacked with the insulation layer by processing surfaces of the upper metal and the lower metal. The lower metal and the upper metal are stacked with the insulation layer by a hot press pressurizing contact method.
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