| 摘要 |
A method for fabricating a leadframe is provided to eliminate the necessity of an additional heat slug by incorporating a heat radiating pad in each unit of a leadframe. A semiconductor chip is electrically connected to a plurality of inner leads(128). An outer lead is connected to each inner lead. A plurality of units(120) includes a side rail(122) and a section bar(124) which constitute a frame, connected to the outer lead. A heat radiating pad(140) is built in the unit to radiate heat. The heat radiating pad is positioned between the confronting inner leads, connected to a part of the side rail or a dam bar(126).
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