| 摘要 |
A semiconductor memory device is provided to be packaged in a changed packaging apparatus, by additionally arranging pads corresponding to the changed packing apparatus and then connecting the additionally arranged pads to previously arranged pads through an additional metal line, if the kind of a packaging apparatus is changed. A plurality of banks(11,12,13,14) is arranged according to a first package standard. Peripheral circuits control data input/output of the plurality of banks, and are arranged according to the first package standard. A plurality of first pads inputs and outputs a plurality of signals to/from the peripheral circuits, and is arranged according to the first package standard. Second pads are arranged according to a second package standard. The second pads correspond to the first pads not arranged according to the second package standard among the plurality of first pads.
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