STRUCTURE OF LIGHT EMITTING DIODE PACKAGE HAVING HIGH LIGHT-EXTRACTION EFFICIENCY AND METHOD OF PRODUCING THE SAME

摘要

A light emitting diode package structure having high light extracting efficiency and a method of manufacturing the same are provided to minimize light loss due to scattering by forming an upper surface of a phosphor film in a dome structure. A light emitting diode package includes a package substrate(33) with a light emitting diode chip mounted on a mounting region, a phosphor film(37) packaging the light emitting diode chip and having a convex structure, and a resin packaging portion(39) packaging the phosphor film and a convex structure. The phosphor film is a convex structure having the same curvature as that of the resin packaging portion. The phosphor film and the resin packaging portion are formed in a semicircular shape.