发明名称 METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS AND/OR CORRESPONDING CONSTRUCTS
摘要 Disclosed is a simplified, inexpensive method for producing printed circuit boards and/or corresponding constructs comprising points where through-connections are created. Such a method dispenses with the need for a very complex brushing process while using exclusively low-cost lacquer variants. Moreover, the inventive method allows additional strip conductors or appropriate layers to be guided even directly across the through-connections rather than just to said through-connections.. ® KIPO & WIPO 2007
申请公布号 KR20070004828(A) 申请公布日期 2007.01.09
申请号 KR20067021172 申请日期 2006.10.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BUSCH GEORG
分类号 H05K3/40;H05K1/09;H05K1/11;H05K3/00;H05K3/42;H05K3/46 主分类号 H05K3/40
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