发明名称 Edge termination in MOS transistors
摘要 A RESURF trench gate MOSFET has a sufficiently small pitch (close spacing of neighbouring trenches) that intermediate areas of the drain drift region are depleted in the blocking condition of the MOSFET. However, premature breakdown can still occur in this known device structure at the perimeter/edge of the active device area and/or adjacent the gate bondpad. To counter premature breakdown, the invention adopts two principles: the gate bondpad is either connected to an underlying stripe trench network surrounded by active cells, or is directly on top of the active cells, and a compatible 2D edge termination scheme is provided around the RESURF active device area. These principles can be implemented in various cellular layouts e.g. a concentric annular device geometry, which may be circular or rectangular or ellipsoidal, in the active area and in the edge termination, or a device array of such concentric hexagonal or circular stripe cells, or a device array of square active cells with stripe edge cells, or a device array of hexagonal active cells with an edge termination of hexagonal edge cells.
申请公布号 US7160793(B2) 申请公布日期 2007.01.09
申请号 US20050066408 申请日期 2005.02.25
申请人 NXP B.V. 发明人 HUETING RAYMOND J. E.;HIJZEN ERWIN A.;IN'T ZANDT MICHAEL A. A.
分类号 H01L21/47;H01L29/06;H01L29/40;H01L29/423;H01L29/739;H01L29/78 主分类号 H01L21/47
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