| 摘要 |
A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connected to the conductive pin. The frame, the chip heat-conducting support and the light-emitting chip are packaged via the package body. The chip heat-conducting support is partially exposed out of the package body for connecting to a heat-dissipating element for increasing the efficiency of heat dissipation of the power LED package module. The power LED package module thus provides electrical conduction and heat conduction in a split manner.
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