| 摘要 |
[PROBLEMS] To provide a polyimidesiloxane solution composition which is excellent in defoaming ability, and can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film. [MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, curable components such as a polyimidesiloxane soluble in the organic solvent, an epoxy compound and a poly-valent isocyanate compound, and a silicone defoaming agent, wherein said silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a fine powdery silica. � KIPO & WIPO 2007 |
